YMTC, a NAND flash manufacturer, is preparing to begin mass production of LPDDR5X memory with 9,600 MT/s speeds at its Fab 3. The company has already been producing about 5,000 wafers per month of 16 Gb LPDDR5X DRAM running at 7,500 MT/s since October 2025, according to Counterpoint Research. The new production will use Vertical Channel Transistor (VCT) 4F² cell structure technology, giving YMTC a significant advantage with 3D silicon architecture.
With its Xtacking 4.0 technology, YMTC can separate memory cell wafers from peripheral logic circuits and combine them using hybrid bonding wafer-to-wafer stacking, enabling flexible transitions to 3D DRAM. This positions YMTC, alongside CXMT, as a leader in 4F² DRAM adoption, potentially giving Chinese memory makers a slight edge despite DUV lithography limitations. Micron has confirmed it will not pursue 4F² DRAM, remaining focused on 6F² layouts until 3D DRAM arrives.
Once 3D DRAM is ready for mass manufacturing, YMTC is well-positioned to capitalize on the technology shift.
Source: TechPowerUp News · Summarized by HeadlinesBriefing