LG Innotek will attend the 2026 Electronic Components and Technology Conference in Orlando, Florida, to reveal its next‑generation semiconductor package substrate technologies. The 76‑year‑old company opens a booth for the first time, targeting 2,000 attendees from 20 countries, including Intel, Amkor, ASE, and IBM to showcase cutting‑edge innovation in chip integration solutions.

LG’s display will feature two large FC‑BGA substrate samples, one 3.3×3.3 inches and an ultra‑large version 40 percent larger. Embedded‑chip technology shortens signal paths, cutting power delivery loss by roughly 25 percent and boosting server efficiency for high‑performance data centers and data centers in AI workloads and enterprise applications across industries worldwide.

At the same booth, LG will unveil its Radio Frequency System‑in‑Package substrates for 5G, built with a proprietary Cu‑Post approach that drops thickness by about 20 percent while raising circuit density. The copper columns allow solder balls to pack tighter, enabling thinner yet high‑performance smartphones for next‑generation mobile devices and consumer electronics in the global market.

CEO Moon Hyuksoo said the conference will cement LG Innotek’s plan to grow its package solution business to a 2.0 billion USD segment by 2030, backed by strong global demand. The move signals a shift toward denser, energy‑efficient substrates that could reshape chip and device design for future technologies and industry leaders today across sectors and markets.