Intel CEO Lip‑Bu Tan revealed that the company plans to enter risk production of the 14A node in 2028, with high‑volume manufacturing slated for 2029. The move aligns with major customers ready to ship 14A silicon worldwide and positions Intel to offer the technology to third‑party foundries.

The 14A process marks the first global use of ASML’s High‑NA EUV lithography, promising better early‑stage yields and a simpler manufacturing flow than Intel’s prior 18A node. Tan highlighted that the 0.9 PDK—dubbed a “holy grail”—will launch in October, enabling designers to lock in volume and design rules.

Intel’s roadmap now includes 10A and 7A nodes, with development slated after 14A trial runs. The company aims to build a continuous evolution of technology, mirroring TSMC’s long‑term foundry strategy to attract customers seeking future‑proof investments.

By advancing the 14A node faster than past efforts and committing to newer nodes, Intel signals a renewed focus on high‑performance manufacturing that could reshape the foundry market.