Taipei’s heat‑ridden streets witnessed a surge of chip leaders. AMD’s Lisa Su outlined AI plans, while Nvidia’s Jensen Huang disclosed that Taiwan‑based supply spending tops $150bn a year. Intel, Qualcomm, Arm and Marvell followed, hunting for chips, packaging and cooling to feed the AI build‑out for data centers across the globe and scalable infrastructure today.

TSMC’s CoWoS once dominated the chatter; now the industry pivots to CPO, or co‑packaged optics. The compact universal photonic engine plugs directly beside processors, slashing power and boosting bandwidth. Early adopters say the shift will reshape supply chains, creating shortages in lasers, indium phosphide substrates and even copper wiring to meet demand surge in AI.

Huawei’s comeback stitches around a new Kirin roadmap unveiled by chief semiconductor He Tingbo. Lacking EUV tools, the company targets phone processors to sidestep U.S. export limits. Meanwhile, private‑equity giants are offloading China data‑center assets—Princeton Digital Group’s sale could fetch $1bn, signaling a retreat from the hot market and reallocate capital elsewhere in Asia for now.

Memory supercycle keeps heating. Micron and SK Hynix step into the trillion‑dollar club, while Sandisk’s CTO warns AI will lean more on memory than raw compute. Demand has pushed transceiver firms like Zhongji Innolight and Eoptolink to earnings surges of 800% and 900% since 2022, tightening the optical supply chain for data centers worldwide today.