SK hynix CEO Kwak Noh-Jung stated the current memory shortage will persist through the end of 2030, citing a shift away from purely commodity DRAM parts. Speaking at the groundbreaking ceremony for the company's new Indiana packaging facility, Kwak explained that gradual easing, rather than sharp price crashes, will likely end the shortage. The facility, targeting volume production by Q2 2029, focuses on HBM4E packaging rather than adding new wafer capacity.

Wafers will continue to be produced in South Korea and shipped to the US. This shift toward customized AI-driven demand for HBM and DRAM configurations makes future supply easier to forecast, suggesting abrupt oversupply swings that previously caused market crashes are less likely. For consumers, DRAM and NAND prices are expected to remain elevated well into the next decade, keeping PC, GPU, and console memory costs high.