TSMC has achieved a near‑perfect packaging yield, establishing a baseline of 98% for its current CoWoS‑L advanced packaging. The technology accommodates a die area equivalent to 5.5x the reticle limit, about 858 mm², enabling the packaging of 4,720 mm² worth of silicon with only 1‑2% of the designs experiencing issues. This marks the first mass‑production scale packaging of a 5.5x reticle chip.

The Taiwanese manufacturer is also preparing for even larger designs, including up to 14x reticle size dies on a singleober package. This would allow a silicon area of 12,012 mm² to be packaged with CoWoS, slated for 2029 when its A13 node enters mass production. TSMC’s timelines remain on track and customer satisfaction stays high.

Designs beyond the 3x reticle limit must be handled carefully, as thermal warping can introduce mechanical issues. The company works closely with customers to overcome these challenges.

In addition to CoWoS, TSMC is advancing its So‑IC hybrid bonding technology, moving from a 6‑µm to a 4.5‑µm pitch by 2029 and enabling high‑density interconnects.