Intel's advanced packaging technology, EMIB (Embedded Multi-die Interconnect Bridge), is gaining traction with external customers for Intel Foundry. The EMIB-T variant, featuring TSVs for direct ASIC power access, is poised to enter high-volume production in 2027, according to Taiwan's Unimicron.

This technology aims to rival TSMC's CoWoS, offering a potential 50% cost advantage. Companies like Broadcom and Meta are reportedly considering switching from CoWoS to EMIB to reduce expenses while retaining or enhancing features. EMIB provides localized, high-density die-to-die routing without the cost of a full silicon interposer.

Intel is currently ramping up its standard EMIB and Foveros offerings. The EMIB-T's projected 2027 volume production signifies Intel's strategy to attract customers seeking advanced packaging solutions, potentially drawing them away from TSMC amidst reports of warping issues with TSMC's CoWoS-L for NVIDIA's upcoming products.