SK hynix is partnering with Intel to apply the Embedded Multi-die Interconnect Bridge (EMIB) 2.5D packaging to its high‑bandwidth memory products, helping diversify its supply chain as AI chip makers consider Intel Foundry for advanced assembly. The effort targets HBM4 modules, aiming to boost performance and density for data‑center GPUs.

EMIB uses tiny bridges embedded in a substrate to link multiple dies without a full interposer. Variants like EMIB‑M with MIM capacitors and EMIB‑T featuring TSVs provide high‑density shoreline connections ideal for logic‑to‑HBM links. Until now, hynix relied on TSMC’s CoWoS 2.5D platform, which is approaching its scaling limits around 830 mm² per reticle. EMIB offers a path to continue chiplet growth beyond those constraints.

SK hynix manufactures its own silicon but outsources advanced packaging, using hybrid bonding and thousands of TSVs for stack‑up. Integrating EMIB means combining dozens of these packages into a single AI accelerator, a step beyond its current CoWoS workflow. R&D is underway with no firm ship‑date, but prototypes are expected within the next few quarters for commercial rollout.