TSMC is reportedly developing an advanced packaging technology, internally dubbed EMIB-like, to compete with Intel's Embedded Multi-die Interconnect Bridge (EMIB). This move comes as TSMC's current Chip-on-Wafer-on-Substrate (CoWoS) packaging may lose customers to Intel's offering.

Taiwan's Kinsus Interconnect Technology is expected to support TSMC in the development, scaling, and manufacturing of this new CoWoS alternative. TSMC currently offers three CoWoS versions: CoWoS-S, a full silicon interposer; CoWoS-L, a hybrid with an organic base and localized silicon bridges; and CoWoS-R, which uses an organic copper/polymer RDL interposer for cost-effectiveness and scalability.

Intel's EMIB technology utilizes substrate-embedded silicon bridges for localized, high-density die-to-die routing, offering a cost-effective alternative to full silicon interposers, especially for high-speed interfaces.