Intel Foundry is on the verge of securing major new contracts this fall, according to UBS Group, with Apple, AMD, Google, and NVIDIA among the tech giants evaluating Intel's manufacturing capabilities. The investment bank points to the release of version 1.0 of Intel's 14A node process design kit as a key catalyst for these potential deals.

Several industry leaders are reportedly considering Intel's silicon manufacturing for their next-generation chips, including the 18A, 18A-P, and 18A-PT nodes, as well as the upcoming 14A node. Apple is rumored to manufacture some of its M-Series processors using the 18A-P node by 2027, while Google might leverage Intel's EMIB and Foveros 3D advanced packaging technology for its TPU designs. These companies typically favor TSMC for its proven reliability and high-volume capacity.

Intel has been investing heavily in attracting external clients, with UBS anticipating multiple foundry commitments being announced this fall. The company's advanced packaging technologies, including EMIB, EMIB-T, and EMIB-M variants, offer unique capabilities for designing 2D, 2.5D, and 3D building blocks. Intel has even demonstrated packages with 47 tiles and envisions multi-kilowatt solutions per package, potentially giving it an edge over competitors like TSMC whose CoWoS technology reportedly struggles with four reticle-sized dies.