Samsung and Qualcomm are forming a 2.1D Packaging Alliance to offer advanced chip packaging using organic bridges that connect silicon dies. Unlike Intel's Embedded Multi-die Interconnect Bridge (EMIB), which uses small silicon bridges, this alliance will employ organic bridges made from materials common in traditional PCBs, such as organic polymer materials like epoxy and copper wiring. The technology uses redistribution layers (RDL) with multiple layers of fine circuitry, making it more similar to PCB manufacturing than silicon manufacturing while achieving packaging densities comparable to EMIB.

Samsung will manufacture the 2.1D package using multiple RDLs inside a flip-chip ball grid array package. Target specifications include organic bridge line width and spacing of 1.5 to 2 micrometers, via sizes of 4 to 5 micrometers, and die-to-die pattern density of 500 to 1,000 per millimeter. Several other Samsung Foundry customers besides Qualcomm have expressed interest.

For Qualcomm, Samsung will use this packaging to create multi-die AI accelerators with multiple compute dies stitched together on a single surface via the organic bridge, functioning as a unified accelerator. Qualcomm has developed this technology since at least 2024 patents for interconnect bridges, while Samsung Foundry handles manufacturing as Qualcomm is a fabless chip designer.