Sony has reportedly released a new version of the PlayStation 5 Slim console that addresses several issues and optimizes manufacturing. According to repair technician @Modyficator89 on X, who opened a console from the Marvel's Wolverine Limited Edition Bundle and shared photos showing a new board labeled EDM-051, Sony has made a few minor changes that should improve the console's longevity, thermal performance, and repair capabilities. One of the most interesting changes is located right on top of the processor.
Sony still uses liquid metal as the thermal interface material (TIM) between the APU and its heatsink, as it did with the previous PS5 Slim, but the way it's held in place has been reworked. The new barrier around the chip leaves less of the metal exposed, creating a seal that reduces the chances of it spreading to nearby parts and ensures efficient heat transfer away from the die. The heatsink has also been rebuilt with different materials and construction than earlier units, similar to the approach taken with the PS5 Pro.
Cooling isn't the only thing that has changed. The board uses a cheaper HDMI retimer chip, indicating that Sony may be trimming costs behind the scenes. The CMOS battery has also been relocated to a more accessible spot, again matching the Pro, so replacing it shouldn't require taking the whole console apart.
All this information comes from a single teardown. Sony hasn't confirmed the changes, and no independent testing has shown how much cooler or more reliable the new setup runs. It's also unclear whether the EDM-051 will appear in every new Slim or only in certain bundles, so we'll have to wait and see more teardown reports to determine where this revision will be deployed.
Source: TechPowerUp News · Summarized by HeadlinesBriefing