Samsung is now targeting 2029 for mass production of its 1.4 nm chip manufacturing node, a shift from its earlier 2028 goal. This delay stems from the ongoing expansion of its 2 nm SF2 and SF2P processes. The revised timeline places Samsung's advanced node alongside industry rivals like Intel, which also aims for high-volume production of its 14A node in 2029.

This move into 1.4 nm manufacturing will involve Samsung's first adoption of High-NA EUV lithography, a significant step up from its current Low-NA EUV tools. The company is securing necessary equipment from major suppliers, including Applied Materials and Lam Research, for its semiconductor R&D hub. ASML is expected to deliver several High-NA EUV units to Samsung by late 2027.

With advanced tools capable of processing hundreds of wafers per hour, Samsung aims to bolster its manufacturing capacity for the 1.4 nm node. While full capacity utilization is unlikely, sufficient production volume is anticipated. In the interim, Samsung will continue supplying its Foundry customers with the established SF2 node and its variants as the industry gears up for next-generation chip production.

This competitive push in advanced semiconductor manufacturing by late decade promises more silicon options for customers currently reliant on TSMC.