Samsung Electronics and AMD inked a Memorandum of Understanding to deepen their partnership on next‑generation AI memory and computing. The ceremony unfolded at Samsung’s flagship chip plant in Pyeongtaek, Korea, with AMD’s Chair Lisa Su and Samsung’s Vice Chairman Young Hyun Jun in attendance. Both leaders underscored a shared drive to push AI hardware forward for the future.

Under the MOU, Samsung will supply HBM4 memory for AMD’s upcoming Instinct MI455X GPU, while both firms will develop DDR5 modules for AMD’s 6th‑generation EPYC CPUs, codenamed Venice. The partnership also targets the Helios rack‑scale platform, aiming to fuse GPUs, CPUs, and storage into a unified AI accelerator stack for large scale applications today and tomorrow.

Samsung’s HBM4, built on a 6th‑generation 10‑nanometer DRAM process and a 4‑nanometer logic base die, delivers up to 13 Gbps per lane and a peak **3.