Samsung expects memory chip demand to remain robust not just in 2026 but also in 2027, driven by AI hyperscalers building massive cloud infrastructure. The company's CTO revealed at Semicon Korea that unprecedented orders from these cloud providers have caused memory prices to skyrocket, with Samsung focusing on mass-producing its next-generation HBM4 technology.

Samsung reported booming sales in Q3 2025 on strong demand for HBM3E, with momentum continuing into Q4. Corporate customers receiving early HBM4 shipments have called the chip's performance "very satisfactory," according to the CTO. The company is also developing hybrid bonding technology for HBM stacks that reduces thermal resistance by 20% and lowers base die temperature by 11% in tests, though consumer availability timelines remain unclear.

Samsung is working on zHBM technology that stacks dies in the Z-axis to boost memory bandwidth 4x while reducing power consumption by 25%. The company has also tested Samsung HBM-PIM memory with custom AMD Instinct MI100 processors, demonstrating that processing-in-memory designs can increase performance 2.8x while maintaining power efficiency. These advancements position Samsung to capitalize on the AI-driven memory demand surge expected to continue through 2027.