AMD is gearing up for its next‑gen server silicon while the “Zen 7” architecture moves closer to tapeout. Taiwanese outlet Commercial Times says the chip will be built on TSMC’s A14 process, the industry’s first angstrom‑scale node. That follows AMD’s recent shift of the “Venice” EPYC line to a 2 nm fab for the upcoming Zen 6 CPUs. The shift aims to outpace Intel’s Sapphire Rapids refresh.

The “Zen 7” compute‑die, codenamed Grimlock, will house 16 cores per CCD and add a suite of AI‑oriented instructions. New ISA blocks include AVX10, which merges AVX‑512 and AVX2 capabilities, and ACE (Advanced Matrix Extensions) for matrix math across servers and even mobile devices. Additional features such as FRED interrupt handling and ChkTag memory tagging aim to cut latency and harden security.

AMD is also probing advanced packaging to keep pace with rivals. The company evaluates Powertech’s Fan‑Out Panel‑Level Packaging (FOPLP) and next‑gen 3D V‑Cache solutions, potentially diversifying away from TSMC’s dominant assembly line. If the A14 node and new packaging deliver on paper, data‑center operators could see higher core density and lower power draw per workload. Such gains could lower total cost of ownership for enterprises.