Intel has processed one million 300 mm silicon wafers using High Numerical Aperture (High NA) Extreme Ultraviolet (EUV) lithography, marking a major milestone in advanced chip manufacturing. The company initially deployed ASML’s TWINSCAN EXE:5000 systems in 2024 for research on the 14A node, but has since expanded High-NA usage to the 18A node and select "Panther Lake" SKUs. Intel is also offering its High-NA setup to external customers through Intel Foundry.

In collaboration with ASML, the company completed acceptance testing for its 14A node using the TWINSCAN EXE:5200 B scanner, improving wafer output. Previously, Intel processed over 30,000 wafers in a single quarter, reducing process steps for a layer from 40 to under 10, significantly speeding up cycle times. Intel remains the only company actively using High-NA EUV lithography in production.

TSMC believes it can maintain competitiveness with existing Low-NA EUV technology, while Samsung Foundry is reportedly delaying High-NA adoption until 2030 for its 1 nm node. High-NA systems from ASML cost around $400 million, making them extremely expensive even for modern fabs.