Qualcomm is slated to roll out two flagship SoCs in September: the Snapdragon 8 Elite Gen 6 and its Pro sibling. Chinese leaker Digital Chat Station posted fresh data on Weibo, confirming the non‑Pro chip carries the model code SM8950 and will be fabricated on TSMC’s 2nm process. The leak suggests the new part targets upper‑midrange devices from Chinese OEMs.

Inside the silicon, Qualcomm introduced an Oryon CPU cluster: two Prime cores, three High‑Performance cores and three Performance cores sharing a 16 MB L2 cache. Graphics run on the Adreno 845 GPU with six slices, backed by 12 MB of dedicated graphics cache and 6 MB system cache. The chipset supports LPDDR5X RAM and UFS 5.0 storage, while some cache and peripheral specs are trimmed versus the Pro version.

With reduced cache and peripheral bandwidth, the Elite Gen 6 narrows the performance gap to its Pro counterpart, positioning it as a cost‑effective alternative for brands that cannot justify the premium. Its 2nm node promises efficiency gains, which should translate into longer battery life for devices that adopt it. Chinese manufacturers will likely be first to ship smartphones built around this chipset.