Samsung is reportedly planning to dual-source chipsets for the upcoming Galaxy S27 Ultra, according to insiders cited by Korean publication Money Today. While the original plan called for the Snapdragon 8 Elite Gen 6 in all markets, encouraging internal benchmarks have made the Exynos 2700 a viable alternative. Samsung MX and LSI have allegedly coordinated to develop an Exynos-based motherboard and secure sufficient supply of the in-house chip.

The strategy mirrors regional divisions used for other S27 models: US units will retain the Snapdragon chip, while Korea and Europe will receive the Exynos variant. This marks the first Exynos-powered Ultra model since the Galaxy S22 Ultra in 2022. The Exynos 2700 is fabricated on Samsung’s enhanced SF2P (2nm) node, promising a 26% power reduction and 15% clock speed boost.

CAD-based renders reveal a redesigned camera island; the device will be similar in size to the S26 Ultra but feature a modest battery upgrade. Samsung is also replacing the 10MP 3x telephoto camera with an improved 50MP 5x telephoto unit. The vanilla S27, S27+, and new S27 Pro will also use a mix of both chipsets.