TSMC is reportedly considering raising prices for its CoWoS (Chip on Wafer on Substrate) advanced packaging by as much as 20%, according to supply chain sources cited by Taiwan’s Commercial Times. Foundries and outsourced packaging firms are also weighing another round of 10% to 20% increases, as CoWoS demand has spread beyond AI GPUs to server CPUs and custom ASICs, leaving a growing backlog of unfilled orders. Testing is turning into a bottleneck; Nomura estimates NVIDIA's Blackwell takes roughly four times longer than Hopper in final testing, while Rubin could need seven times as long.
Packages keep growing too, with TSMC already mass producing CoWoS-L at 5.5 times reticle limit. Tool lead times have stretched from three to eight months, and TSMC placed this year’s equipment orders at existing prices, signaling tight supply. Liberty Times reports TSMC will raise wafer prices 3% to 6% from January 2027, with 2nm and 3nm seeing the steepest hikes.
Global Foundries signed a five‑year, $2 billion deal to make CoWoS silicon interposers in New York, with volume production expected in the first half of 2028, offering some relief. The pressure is mainly on data centers, as gaming graphics cards do not use CoWoS, though pricier wafers may eventually reach consumer chips. TSMC has not confirmed any price changes yet.
Source: TechPowerUp News · Summarized by HeadlinesBriefing