Micron Technology, Inc. (Nasdaq: MU) announced the world's first 512 GB DDR5 module on multiple server platforms. AMD and Intel are validating the module, which delivers speeds up to 9,200 MT/s.

The module uses advanced vertical interconnect packaging, stacking DRAM dies with through-silicon vias (TSVs) to maximize density. It enables up to 12 TB of DDR5 DRAM in a single 24-slot dual-socket server.

Raj Narasimhan, SVP at Micron, said the 512 GB RDIMM supports larger AI and database workloads, greater virtualization density, and improved power efficiency. It reduces operating power by over 60% compared to four 128 GB RDIMMs and delivers up to 1.4x higher performance for memory-bound workloads like Spark SVM.

Ecosystem partners AMD and Intel are collaborating to validate the module across next-generation server platforms. Amit Goel of AMD and Karin Eibschitz Segal of Intel highlighted the importance of memory capacity and bandwidth for AI and data-intensive workloads.