Enplas unveiled a new family of pure‑copper water‑block cold plates at Computex 2026, targeting the rising demand for liquid cooling in AI GPUs and high‑core CPUs. The design replaces standard extruded microfin lattices with a topology‑optimized network of interlocking copper fins that expand surface area and improve heat transfer to coolant.

The copper structure, shown next to a ruler on the display board, illustrates a scaled‑up version of the fin‑lattice. By routing coolant through channels that weave through the copper, the block achieves a markedly higher surface area than conventional blocks, boosting thermal conductivity and allowing higher TDP components to stay within safe temperature limits.

Enplas’ injection‑molding expertise lets the company mass‑produce the complex lattice without compromising structural integrity. The result is a lightweight yet robust cooling solution that can be integrated into server racks or custom builds, potentially reducing the need for bulky external cooling systems and lowering overall power consumption.

By pushing the limits of copper microfin design, Enplas demonstrates that liquid cooling can keep pace with the industry’s shift toward higher‑performance silicon. The new cold plates offer a tangible path to more efficient data centers and enthusiast rigs alike, making advanced cooling a more accessible reality.