Apple and Broadcom have signed a multiyear pact that will push production of more than 15 billion U.S.-made chips and cost over $30 billion. The deal expands Broadcom’s Fort Collins, Colorado facility with a $1.5 billion capital outlay, where the company will build advanced RF components such as FBAR filters and new wireless connectivity modules.

The agreement sits inside Apple’s American Manufacturing Program (AMP), which launched last year to speed domestic production of key parts for iPhone, iPad, Mac, Air Pods, Apple Watch, and Vision Pro. Apple’s CEO Tim Cook said the new phase of the partnership “accelerates our commitment to American manufacturing and innovation.” Broadcom’s president Hock Tan echoed the sentiment, noting the company’s intent to grow its footprint in Fort Collins.

Apple’s total U.S. investment plan tops $600 billion over four years, aiming to create hundreds of jobs and solidify a domestic silicon supply chain. The scale of this commitment signals a broader industry shift toward reducing reliance on overseas fabs.

For consumers,ուգ the move means faster, more reliable connectivity in future Apple products. For the U.S. tech sector, it signals a commitment to building core manufacturing capacity that could keep pace with global competitors.