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Apple, Broadcom Pact to Build 15B U.S. Chips

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Apple announces a new multiyear commitment with Broadcom that will exceed $30 billion to design and produce custom silicon and advanced wireless connectivity for its products.

The deal will yield more than 15ňe U.S.-made chips and supports hundreds of American jobs, marking the largest order in Apple’s American Manufacturing Program. It deepens a partnership that has already delivered custom silicon for iPhones, Macs and wearables.

Broadcom will expand its Fort Collins facility with a $1.5 billion capital investment. Production will focus on radio‑frequency components, including FBAR filters, and next‑generation wireless modules that power Apple’s high‑performance devices.

Apple’s $600 billion pledge to U.S. manufacturing over four years is bolstered by this agreement, tightening the domestic silicon supply chain and reducing reliance on overseas fabs.