A leak from Hong Kong's HKEPC details AMD's rumored Gorgon Halo mobile processor family, branded as the Ryzen AI Max 400 series. The report lists five SKUs, from the 8-core Ryzen AI Max 485 to the flagship Ryzen AI Max+ 495. All chips reportedly use Zen 5 CPU cores, RDNA 3.5 integrated graphics, and XDNA 2 NPUs, maintaining the same 55W TDP as current models.

These chips are positioned as a refresh of the existing Strix Halo APUs, promising higher clock speeds for improved multicore performance. HKEPC suggests enhanced chip quality enables this half-generation upgrade without changing thermal design power. An engineering sample with the serial code 100-000002127, believed to be the Ryzen AI Max 485, was also pictured.

The publication anticipates a launch around October 2026. This refresh aims to keep AMD's mobile AI platform competitive ahead of Intel's next-gen offerings. Consumers can expect better performance in thin-and-light laptops and handhelds that rely on these powerful APUs for gaming and AI workloads.