Samsung is ditching Fan-Out Wafer-Level Packaging for its next flagship chipset. The Exynos 2700 will reportedly switch to a Side-by-Side (SbS) architecture, placing the application processor and DRAM next to each other on the substrate rather than stacking them. The move impacts how the SoC will be built for the upcoming Galaxy S27 and Galaxy S27+.

FOWLP technology improved thermal performance since the Exynos 2400, but manufacturing it proved too complex and costly. Shifting to SbS should cut expenses while Heat Pass Block (HPB) technology compensates for potential thermal trade-offs. The change reflects Samsung balancing efficiency against profitability in its chipset design choices.

The Exynos 2700 is expected to debut with the Galaxy S27 series in early 2027. Samsung's packaging redesign could alter how the chips handle heat during real-world use, a detail worth watching given that thermal throttling has historically been a pain point for Exynos-powered devices.