Samsung has reportedly finished the design of its next flagship processor, the Exynos 2700, according to Yonhap News. The chip will run on a 2nm process, mirroring the architecture of the current Exynos 2600. Industry insiders say the move follows the 2600’s strong performance in South Korea in the competitive smartphone market for consumers worldwide.

The 2600, released last December, delivered a 39% jump in CPU speed and doubled GPU power over its predecessor, all on a 2nm node. Samsung dropped low‑power cores to focus on performance and efficiency. Yet overheating has plagued earlier Exynos models, prompting the company to introduce Heat Path Block (HPB) packaging to spread heat across.

Samsung is tightening heat control by refining HPB, which places components side‑by‑side instead of stacked, according to Android Headlines. Sample chips are already in production, setting the stage for full‑scale manufacturing later this year. If