Samsung's new Exynos 2600 application processor features a proprietary Heat Path Block (HPB) technology. This FoWLP_HPB packaging design improves heat dissipation by reducing DRAM obstruction and attaching a dedicated block, cutting thermal resistance by up to 16%.

Leakers report HPB tech is now being adopted by several non-Samsung chip manufacturers for next-gen Android chips. This addresses a key challenge for rivals like Qualcomm, whose upcoming Snapdragon 8 Elite SoCs demand more potent cooling solutions to handle higher frequencies.

Better thermal management could unlock greater overclocking potential in future mobile chips. The shift away from older, heat-blocking DRAM layer designs is becoming critical as flagship smartphone processors push performance limits.