TSMC is investing NT$100 billion (US$3.16 billion) to convert Fab 15A from 28/22 nm to 4 nm production. Displaced equipment will be repurposed at the Dresden facility, supporting automotive and industrial markets. Fab 15B continues on 7 nm technology.

The advanced node development progresses faster than planned, with TSMC's 1.4 nm Taichung site potentially starting trial production in Q3 2027. The company's new A13 (1.3 nm) process offers a 6% area reduction with improved performance, entering mass production in 2029.

When complete, the Taichung complex will become the world's largest production base for AI and HPC chips. These investments solidify TSMC's position at the forefront of semiconductor manufacturing, supporting next-generation computing demands.