Socionext Inc., a global leader in custom system-on-chip (SoC) design, announced it will leverage Intel 18A-P process technology to develop custom SoCs for datacenter, edge, and high-performance computing customers. The first project is a high-performance compute chiplet. By combining its ASIC expertise with Intel Foundry's advanced process and packaging roadmap, Socionext will enable customers to create differentiated SoC solutions optimized for application-specific workloads.

"Intel 18A-P represents an important step in advanced process technology, combining innovations in transistor architecture and power delivery," said Rajinder Cheema, CTO and Executive Vice President at Socionext. "By developing SoC capabilities on this process, Socionext is enabling our customers to address the evolving performance and power requirements of AI, HPC, and advanced datacenter applications."

"The combination of Socionext's Solution SoC development methodology and Intel Foundry's advanced process and packaging technologies enriches the ecosystem for enabling product development for AI acceleration, high-performance compute, and Physical AI," said John Zucker, General Manager and Vice President of Global Business Development and Marketing, Intel Foundry. "Together we accelerate our customers' time-to-market from architecture to production."

Socionext, based in Yokohama, operates offices across Japan, Asia, the United States, and Europe.