Samsung Foundry may soon manufacture custom AI accelerators for AI lab Anthropic on its SF2 2 nm node. Initial production is expected at around 200,000 chips, a modest start for a project Anthropic is still validating. Broadcom is handling the ASIC design and implementation, targeting roughly 4,000 TOPS of INT8 compute with a TDP of 1,300 W per chip.
Memory support will likely be 192 GB or up to 288 GB of HBM3E. The SF2 node uses Low-NA EUV lithography and is manufactured in South Korea, with a new facility planned for Taylor, Texas. Samsung will likely use its I-Cube packaging technology to integrate the dies with HBM.
Beyond the Anthropic deal, Samsung and Qualcomm are reportedly forming a 2.1D Packaging Alliance using organic bridges made from epoxy and copper to interconnect silicon dies. This move aims to help Samsung close the gap with TSMC in advanced packaging and contract manufacturing.
Source: TechPowerUp News · Summarized by HeadlinesBriefing