Global 300 mm front-end fab equipment spending is projected to reach $149 billion in 2026, up 31% year-over-year, SEMI reported. Investment is expected to continue growing at double-digit rates through 2029, reaching $227 billion. The stronger investment trajectory is accompanied by a sustained pipeline of new 300 mm fabs and production lines moving through construction and into operation.
Excluding pure R&D fabs, SEMI projects 20 new 300 mm fabs or lines to begin construction worldwide in 2026 and 18 in 2027. In the United States, three are projected to begin construction in 2026 and four in 2027. Global fab construction spending is projected to rise 23% to $47.5 billion in 2026 and another 33% to $63.3 billion in 2027, before reaching $68.4 billion in 2028.
Ajit Manocha, SEMI President and CEO stated, "Semiconductor demand is increasingly translating into physical manufacturing expansion across the global industry. The latest outlook points to both stronger equipment investment and a substantial pipeline of fabs moving toward operation. This expansion will provide the manufacturing foundation needed to support AI, high-performance computing and a broad range of next-generation semiconductor applications."
Equipment investment in the Americas is projected to more than double from $18.1 billion in 2026 to $40.6 billion in 2029, reflecting the region's expanding manufacturing footprint. SEMI projects 13 new 300 mm fabs or lines worldwide to begin operations or ship first silicon in 2026, increasing to 23 in 2027.
Source: TechPowerUp News · Summarized by HeadlinesBriefing