Fibocom unveiled its new 5G SoC Dongle solution series at MWC 2026, featuring an integrated system-on-chip design that combines high-performance 5G connectivity, Android OS, and flexible eSIM/vSIM services. The solution targets the global mobile broadband market with a focus on cost efficiency and scalability.

Built around an octa-core CPU running up to 2.3 GHz with Adreno 613 GPU, the dongle delivers exceptional data processing alongside ultra-fast 5G speeds. The highly integrated SoC architecture reduces peripheral components, improving production yields while significantly cutting development and material costs for operators and enterprise customers.

Running Android OS, the device transforms from a simple connection tool into a smart terminal supporting customized applications like VPNs, firewalls, and traffic monitoring. With USB 3.1 high-speed data transfer, it meets enterprise-grade security and remote management requirements. The solution supports global Sub-6 GHz bands, achieving downlink rates up to 2.5 Gbps with 256QAM modulation and 1T4R antenna technology.