TSMC, the world's largest chipmaker, is reportedly considering entering the memory sector with advanced DRAM technologies. According to The Information, TSMC is contemplating starting production of 3D DRAM at the request of its largest customer, NVIDIA. This move addresses a desperate need for more DRAM output from the three major memory makers: SK Hynix, Samsung, and Micron.
While new manufacturing capacity is being developed, a supply imbalance may persist even when it comes online. Conventional DRAM is currently produced by the big three, with plans to advance into 3D DRAM beyond what HBM currently offers. Micron recently confirmed it is opting for the path to 3D DRAM rather than bringing 4F² DRAM to market, despite claiming to have invented the cell design.
As one of the most experienced silicon manufacturers globally, TSMC is evaluating this path. Overseeing these plans would be TSMC's Hsu Kuo-chin, vice president for advanced packaging technologies like Co Wo S and Co Po S. With extensive experience in 3D silicon stacking, he could be instrumental in pushing TSMC's mass production.
TSMC is reportedly considering building new factories for this advanced memory or acquiring an already-built facility to convert for DRAM production, which would significantly reduce time to market compared to building a new fab.
Source: TechPowerUp News · Summarized by HeadlinesBriefing