At CES 2026, SK Hynix showcased a significant advancement in high-bandwidth memory technology with the introduction of its 16-layer 48 GB HBM4 memory modules. This development is a leap forward from the previous 12-layer 36 GB HBM4, which operated at 11.7 Gbps. The new HBM4 modules are specifically designed for high-capacity AI and HPC (High-Performance Computing) accelerators, addressing the industry's growing demand for memory-intensive applications.

Although official data on the new module's speed is not yet available, the addition of four extra DRAM layers suggests a potential increase in bandwidth. This innovation positions SK Hynix at the forefront of memory technology, potentially offering enhanced performance for AI and HPC applications. Furthermore, the company demonstrated the custom base die HBM, or cHBM, which includes a customized base die with logic usually associated with GPU/ASIC dies.

This allows for more compute logic on the die, maximizing performance and providing customers with the flexibility to embed processing logic within the die area, a significant step towards integrating memory and compute functions. As competitors like Micron and Samsung also work on enhancing their HBM4 modules, the technology landscape is set for further advancements, potentially influencing the future of AI and HPC accelerators from companies such as AMD and NVIDIA.