Intel Foundry reports a significant win as SK hynix becomes a customer for EMIB advanced packaging. At Hot Chips 2026, SK hynix confirmed collaboration with TSMC to integrate HBM memory into CoWoS-L, CoWoS-S, CoWoS-R, and Intel EMIB. The company highlighted HBM4's progression from ~1,024 to 2,048 pins, requiring increased TSVs and advanced 2.5D packaging, hybrid bonding, and 3D DRAM integration for AI accelerators.

As customers diversify from TSMC's CoWoS, Intel's EMIB-T variant offers vertical power delivery via TSVs across stacked chips, supporting SK hynix's 3D memory module concept. EMIB-T provides up to 50% cost savings over CoWoS by avoiding expensive interposers, enabling investment in more HBM production and revenue growth.