SK hynix held a groundbreaking ceremony for its first U.S. HBM advanced packaging facility in West Lafayette, Indiana, at Purdue University. The $4 billion+ plant will begin mass production of next-generation HBM in H2 2029, creating ~7,000 jobs. Officials including Indiana Governor Mike Braun and Senator Todd Young attended.

The fab will receive wafers from Korea for packaging and testing, strengthening the U.S. AI supply chain and fostering local supplier partnerships.