Samsung Foundry, a subsidiary of Samsung Electronics, is reportedly dedicating half of its 4 nm manufacturing capacity (SF4) to produce base dies for HBM4 memory, according to Korean media. The SF4 node operates at Pyeongtaek Campus 2 (P2) and Campus 3 (P3) on lines S5 and S6. Customers are requesting custom logic — such as memory controllers and PHYs — integrated directly onto the HBM base die, reducing space needed on main compute chiplets. This shift supports ASIC customers seeking maximum performance.

Samsung's HBM market share by revenue surged to 38% in Q2 2026, up from 15% a year earlier. Meanwhile, rival SK hynix saw its share drop from 64% to 50% over the same period as buyers diversified supply chains. With expanded custom base die offerings and capacity growth, Samsung Foundry is positioned to capture further revenue share in coming quarters if foundry operations continue to perform well.