Kyocera has developed a new multilayer ceramic core substrate for advanced semiconductor packages, to be unveiled at ECTC 2026 in Orlando. The company targets xPUs and switch ASICs, which are scaling in complexity as AI data center architectures evolve. Built from proprietary Fine Ceramic materials, the substrate addresses growing demand for higher-performance components in next-generation computing systems.

The new substrate offers exceptional rigidity and high-density wiring that dramatically reduces deformation in high-performance packages. Kyocera's multilayer ceramic structure enables finer wiring through superior microfabrication, creating smaller via diameters and tighter pitches. This technology supports custom design requirements with performance simulations during the development phase.

Organic materials currently create bottlenecks in semiconductor packaging due to warpage and miniaturization challenges. Kyocera's ceramic substrate directly addresses these limitations, enabling higher device performance while facilitating further miniaturization. The development reflects the company's commitment to advancing packaging materials that meet evolving needs in the semiconductor industry amid AI data center proliferation.