At NEPCON Japan 2026, Intel unveiled a glass core substrate designed for next-generation AI and HPC accelerators. The 78x77 mm package can hold about 1,716 mm² of silicon, doubling traditional reticle limits. It’s the first 10-2-10-thick substrate, featuring 10 redistribution layers on top and bottom for dense routing.

This EMIB multi-chip technology uses a brittle 800 μm glass core with embedded metal layers for signal and power delivery. Intel solved the SeWaRe micro-cracking issue during dicing, a major hurdle for glass substrates. The design offers better heat resistance, less warping, and improved electrical isolation versus organic materials.

The 45 μm bump pitch enables tight interconnects, while two EMIB bridges let manufacturers combine smaller dies. For consumers, this means more powerful, efficient AI chips. The industry is watching to see if Intel can scale this complex, costly process to compete with rivals like TSMC.