Intel's Core Ultra Series 3 'Panther Lake-H' mobile processor architecture has been revealed in detail through die annotations by Kurnal Insights. The chip follows Intel's disaggregated design philosophy, splitting functionality across multiple tiles built on different foundry nodes. This modular approach continues the company's strategy of separating CPU, GPU, and I/O components for improved performance and efficiency.

At the heart of Panther Lake-H is the Compute tile, built on Intel's 18A process node, which houses 16 CPU cores including six 'Cougar Cove' performance cores and eight 'Darkmont' efficiency cores. The architecture includes a low-power island with four additional E-cores for background tasks. The Graphics tile, fabricated on Intel 3 for mainstream models, contains four Xe cores, while ultraportable variants feature a more powerful 12-core configuration on TSMC N3E.

The I/O tile, built on TSMC N6, provides modern connectivity including four PCIe 5.0 lanes, eight PCIe 4.0 lanes, and integrated Wi-Fi 7 plus Bluetooth 5.4 support. Intel's NPU 5 neural processing unit and advanced memory controllers round out the feature set. This heterogeneous chip design represents Intel's continued evolution in mobile processor architecture, balancing performance, power efficiency, and connectivity for next-generation laptops.