Intel appointed Seok-Hee Lee as executive vice president of Intel Foundry, reporting to CEO Lip-Bu Tan. In the role, Lee will lead advanced packaging, system integration, back‑end technology development and manufacturing, bolstering Intel's ability to deliver differentiated, system‑level innovation. The move signals Intel's push to compete with rival foundries on high‑performance chiplet solutions.

The appointment follows Intel's decision to treat advanced packaging as a standalone business, reflecting its growing role in AI and high‑performance computing where power efficiency and heterogeneous integration are critical. Lee arrives from SK On, where he served as president and CEO, and previously led SK hynix. He also held engineering roles at Intel and in academia, giving him deep process and manufacturing expertise.

Naga Chandrasekaran will remain EVP of Intel Foundry, overseeing front‑end technology and the ramp of the 18A and 14A nodes, while Navid Shahriari retires after 37 years. Intel says the new structure gives customers confidence in speed, consistency and predictability as it prepares to volume‑ship EMIB‑T and HBI technologies. The reorganization tightens Intel's supply chain for system‑level chip solutions.