Asetek introduced its next-generation liquid cooling architecture at Computex 2026, targeting the escalating thermal demands of AI computing. The Emma V3 [Gen10] platform delivers a 1.5°C reduction in thermal resistance while cutting acoustic volume by 45% compared to the previous generation. This evolution features dual-offset cold plate design optimized for modern CPU hotspots.

The company leveraged its integration with Chunqiu Electronic to combine Danish engineering expertise with Asian manufacturing scale. Asetek showcased partnerships with major brands including ASUS ROG, which will debut an exclusive limited edition cooler built on the Emma platform. CEO André Sloth Eriksen emphasized that liquid cooling has become foundational infrastructure for AI performance rather than optional enhancement.

ADATA, NZXT, and TRYX will display Ingrid G9-powered AIO models offering up to 3°C CPU temperature reductions. The Ingrid Mainstream targets ultra-low acoustics at 18-20 dB(A), while Ingrid Value provides cost-effective options for broader enthusiast adoption. These platforms address both gaming and professional markets.

Asetek also presented workstation solutions supporting Intel Xeon and AMD Ryzen Threadripper processors with 100% Integrated Heat Spreader coverage. These designs unlock extreme 450W+ TDP limits, meeting high-density compute demands that exceed traditional consumer hardware constraints. Partner booths from ASUS, Antec, ASRock, and Phanteks will demonstrate the complete ecosystem.