Apple’s first foldable iPhone will launch in September, powered by the same A20 Pro chip that will appear in the iPhone 18 Pro and iPhone 18 Pro Max. Industry analyst Jeff Pu says the new device will use TSMC’s 2 nm N2 process, promising up to 15 % faster performance and 30 % better efficiency.

Both the foldable and the Pro models will feature TSMC’s Wafer‑Level Multi‑Chip Module (WMCM), integrating RAM directly onto the same wafer as the CPU, GPU and Neural Engine. The tighter layout should boost Apple Intelligence speed, extend battery life, and free interior space for other components.

Rumored specs also include 12 GB of LPD5 RAM, a 48‑megapixel rear camera, and Apple’s C2 modem. The book‑style fold will display a 7.8‑inch inner screen and a 5.5‑inch outer panel, measuring 4.5 mm when open and 9–9.5 mm when closed, with Touch ID and dual front cameras.

Apple’s split‑launch strategy pushes the regular iPhone 18 and the budget iPhone 18e to spring 2027, allowing the company to focus marketing on the premium lineup first. Analysts expect the foldable’s advanced chip and compact design to set a new benchmark for mobile form factors, potentially influencing competitors’ next‑generation devices.