A leaked motherboard photo posted by Weibo accounts WHYLAB and Ice Universe appears to show Apple's upcoming A20 Pro chip built on TSMC's Wafer-Level Multi-Chip Module (WMCM) packaging. The design moves LPDDR6 memory off the top of the processor, promising better heat dissipation and lower thermal coupling during sustained workloads.

WMCM replaces Apple’s traditional package‑on‑package layout, keeping the chip size similar to the A19 Pro while expanding the neural processing unit. Coupled with TSMC's 2nm (N2) process, the chip could deliver up to 15% faster performance and 30% improved efficiency, aided by new SHPMIM capacitors that double capacitance density.

If the image proves authentic, the iPhone 18 Pro and its foldable sibling will ship with 12 GB of RAM, 48‑megapixel cameras, and Apple’s C2 modem, all slated for a September launch. The packaging shift signals Apple’s push for higher AI throughput and more stable power delivery in its flagship line.