Defense and aerospace systems face challenges with data-intensive, high-performance computing (HPC) at the tactical edge. Legacy architectures struggle with increasing sensor resolution and exponential data growth, straining processing and power budgets within strict SWaP limits.

The shift to all-digital, edge-native architectures is crucial. This enables processing data closer to the sensor, improving performance, flexibility, and efficiency. Innovations in digital pixel architecture allow for higher resolution without exceeding power and thermal limits.

Intel 18A process technology offers significant improvements in power efficiency and density, vital for SWaP-constrained environments. Advanced packaging technologies, like 2.5D and 3D integration, enable heterogeneous systems by combining chiplets. To overcome thermal limitations, Intel is exploring high-performance Integrated Heat Spreaders (IHS) for liquid cooling.

To address supply chain security, Intel is collaborating with the Department of the Air Force on the Secure Enclave program. This U.S.-based secure manufacturing capability aims to provide domestic production of sensitive microelectronics, building on initiatives like RAMP and SHIP.