Imec has launched a groundbreaking consortium with 26 European universities to advance CMOS 2.0 technology, a new paradigm that moves beyond traditional transistor scaling. This initiative brings together academic institutions and industry partners to develop next-generation chip architectures and design automation tools. The consortium will leverage imec's NanoIC pilot line in Leuven to transform academic research into practical innovations.

The CMOS 2.0 approach introduces fine-grain wafer stacking technology that enables more design flexibility and higher technology heterogeneity. This allows for 3D-stacked chip designs with multiple layers performing specialized functions, potentially delivering significant improvements in compute performance and energy efficiency. The technology aims to address scaling challenges that have limited traditional semiconductor development.

This collaboration represents a strategic effort to strengthen Europe's semiconductor ecosystem by developing expertise in advanced computing technologies. Twenty-six PhD students will be funded across participating universities, gaining early exposure to next-generation semiconductor processes through imec's state-of-the-art facilities. The consortium includes prestigious institutions like EPFL, ETH Zurich, and Delft University of Technology, creating a network of expertise focused on shaping the future of chip design.