Chinese memory giant CXMT is rapidly expanding, projected to produce about 350,000 DRAM wafers per month by the end of 2026, nearly matching Micron’s estimated 375,000. CXMT’s cleanrooms are built in just 12 months, a year faster than the industry norm.

The company faces U.S. sanctions that bar access to modern EUV scanners, so it relies on older DUV lithography tools and multi‑patterning techniques. Despite these hurdles, CXMT has begun shipping 16 Gb DDR5 chips at 8,000 MT/s and is mass‑producing 24 Gb modules at ~6,000 MT/s, as well as LPDDR5X‑10667 modules.

Demand from the AI sector fuels this production surge. The Chinese government encourages CXMT to share its DRAM IP with other domestic makers like JHICC, Swaysure, and YTMC’s XMC to ease shortages before CAMT‑designed DRAM enters markets such as the EU and possibly the U.S.