Congatec has unveiled five new Computer-on-Modules powered by Intel's Core Ultra Series 3 processors, codenamed Panther Lake. The modules, available in COM-HPC and COM Express form factors, promise up to 180 TOPS of AI performance, eliminating the need for discrete AI accelerators in embedded computing applications.

The lineup includes the credit card-sized MC1000 (55 x 84 mm) supporting up to 32 GB LPDDR5X memory, the rugged TC1000 and TC1000r models with dual SODIMM or LPCAMM2 options, and the largest HPC/cPTL variant (95 x 120 mm) supporting 96 GB LPDDR5X. Each module targets different use cases, from compact deployments to high-capacity edge AI workloads.

While Congatec hasn't issued comprehensive PR materials, detailed product pages are available for customers to configure memory options and request quotes. The modules represent a significant leap for embedded computing, bringing desktop-class AI capabilities to industrial and edge applications through Intel's latest processor architecture.