AMD will offer the first Versal adaptive SoCs with native support for Universal Chiplet Interconnect Express (UCIe) 1.1 interfaces, enabling low-power, high-bandwidth communication between co-packaged AMD adaptive SoCs and specialized chiplets. As designers seek greater flexibility, higher performance and faster development cycles, monolithic devices are giving way to modular chiplet-based systems built from specialized silicon components in a single package. UCIe, an open industry standard, allows system designers to combine specialized silicon in a single package instead of redesigning large monolithic SoCs or developing a new SoC for every application.

"The semiconductor industry is entering a new era where innovation is increasingly driven by chiplet architectures that combine specialized chiplets to meet specific use cases. AMD Versal RF Series chiplets are uniquely positioned to be the starting point to harness UCIe connectivity, bringing heterogeneous compute architecture with up to 80 TOPS of DSP compute, integrated RF converters and SWAP-C benefits to customers and unlocking the next generation of adaptive RF systems." - Kirk Saban, corporate vice president, Product, Software and Solutions, AMD Embedded.

AMD Versal RF Series devices will be the first Versal adaptive SoCs to enable UCIe 1.1 connectivity. They will support up to four independent UCIe-SP (standard-package) interfaces and up to two UCIe-AP (advanced-package) interfaces, providing multi-terabit per second aggregate in-package bandwidth. Additional AMD adaptive SoCs with UCIe support will be added as the market matures.

The introduction of UCIe connectivity for select Versal RF Series adaptive SoCs transforms the device into a scalable chiplet platform capable of serving a broad range of next-generation RF, AI, networking and communications applications and enables SWAP-C reduction. Production chiplets are expected to be available with select Versal RF Series devices in the fourth quarter of 2027.